ultrasonic bonder的例句大全

Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.

超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。

Analysis of Some Factors Improving Performance of Ultrasonic System in Wire Bonder

提高引线键合机超声系统性能的若干因素的分析

Model CL-ⅱ Ultrasonic Bonder

CL-Ⅱ型超声键合机

Anti-jamming Design in Force Signal Acqusition System of Ultrasonic Al Wire Bonder

超声波铝线邦定机压力信号采集系统的抗干扰设计

Fundamental Principles and Methods of Ultrasonic Control in Wire Bonder

键合机中超声波的基本控制原理及方法

Based on the analysis model, the ultrasonic transfer on the horn of wire bonder was studied.

基于解析模型的方法, 研究了超声波在热超声金丝球引线键合机变幅杆中的传递规律.

Ultrasonic transfer on horn of wire bonder

超声波在引线键合机变幅杆中的传递规律